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 ESDALC6V1-1BM2
Single line low capacitance TRANSILTM for ESD protection
Applications
Where transient overvoltage protection in ESD sensitive equipment is required, such as:

Computers Printers Communication systems Cellular phone handsets and accessories Video equipment SOD-882
Features

1 line low capacitance TRANSIL diode Bidirectional ESD protection Breakdown Voltage VBR = 6.1 V min. Low diode capacitance (22 pF typ. at 0 V) Low leakage current: < 100 nA at 3 V Very small PCB area: 0.6 mm2 Leadfree package
Functional diagram
I/O1
Description
The ESDALC6V1-1BM2 is a bidirectional single line TVS diode designed to protect the datalines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required.
I/O2
Order code
Part number ESDALC6V1-1BM2 Marking P
Benefits

High ESD protection level High integration Suitable for high density boards
Complies with the following standards:
IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge)
TM: TRANSIL is a trademark of STMicroelectronics
MIL STD 883E - Method 3015-7: class 3 HBM (Human body model)
January 2007
Rev 1
1/7
www.st.com
Characteristics
ESDALC6V1-1BM2
1
Characteristics
Table 1.
Symbol VPP(1) PPP(1) IPP Tj Tstg TL TOP
Absolute maximum ratings (Tamb = 25 C)
Parameter Peak pulse voltage (IEC 61000-4-2 contact discharge) Peak pulse power dissipation (8/20 s) Repetitive peak pulse current (8/20 s) Junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s Operating temperature range Tj initial = Tamb Value 30 140 9 125 - 55 to + 150 260 - 40 to + 125 Unit kV W A C C C C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Symbol VRM VBR VCL IRM IPP VF
Electrical characteristics (Tamb = 25 C)
Parameter Stand-of voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Forward voltage drop C@0V Bias typ. pF 22
VBR VRM IR IRM IRM IR VRM VBR V I
VBR @ IR Part Number min. V ESDALC6V1-1BM2 6.1 max. V 8.0 mA 1
IRM @ VRM max. nA 100 V 3
Rd typ. 0.65
T max. 10-4/C 2.5
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ESDALC6V1-1BM2
Characteristics
Figure 1.
Relative variation of peak pulse power versus initial junction temperature
Figure 2.
Peak pulse power versus exponential pulse duration
PPP[Tj initial] / PPP[Tj initial=25C)
1.1 1.0 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 1000
PPP(W)
Tj initial=25C
Tj(C)
10 1
tp(s)
10 100
Figure 3.
Clamping voltage versus peak pulse current (typical values)
Figure 4.
Junction capacitance versus reverse voltage applied (typical values)
IPP(A)
100.0
Tj initial=25C
C(pF)
25
F=1MHz VOSC=30mVRMS Tj=25C
20 10.0 15
10 1.0 5
VCL(V)
0.1 0 5 10 15 20 25 30 35 40 0 0 1 2
VLINE(V)
3 4 5
Figure 5.
Relative variation of leakage current versus junction temperature (typical values)
Figure 6.
ESD response to IEC 61000-4-2 (+15 kV air discharge) on each channel
IR[Tj] / IR[Tj=25C]
100
VR=3V
10
Tj(C)
1 25 50 75 100 125 150
3/7
Ordering information scheme
ESDALC6V1-1BM2
Figure 7.
ESD response to IEC 61000-4-2 (-15 kV air discharge) on each channel
Figure 8.
S21 attenuation measurement result
dB
0.00
-3 dB
- 10.00
- 20.00
- 30.00
F (Hz)
- 40.00 100.0k 1.0M 10.0M 100.0M 1.0G
2
Ordering information scheme
ESDA LC 6V1 - 1 B M2
ESD Array Low Capacitance Breakdown Voltage 6V1 = 6.1 Volts min Number of lines Directional B = Bi-directional Package M2 = SOD882
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ESDALC6V1-1BM2
Package information
3
Package information
Epoxy meets UL94, V0 SOD-882 dimensions
TOP VIEW
Table 3.
Dimensions Ref.
E
D
INDEX AREA (D/2 x E/2)
Millimeters Min. Typ. 0.47 Max. Min.
Inches Typ. Max.
A
SIDE VIEW
0.40 0.00 0.20 0.20
0.50 0.016 0.019 0.020 0.05 0.000 0.002
A1
A1
A
b1 b2
0.25 0.25 1.00 0.60 0.65
0.30 0.008 0.010 0.012 0.30 0.008 0.010 0.012 0.039 0.024 0.026 0.55 0.018 0.020 0.022 0.55 0.018 0.020 0.022
BOTTOM VIEW
b1
INDEX AREA (D/2 x E/2)
b2
D E
L2
L1
OPTIONAL PIN # 1 ID
e L1 0.45 0.45
0.50 0.50
e
L2
Note:
Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 9. SOD-882 footprint (dimensions in mm)
0.55
0.55
0.50
0.40
5/7
Ordering information Figure 10. Tape and reel specifications
Pin 1 indicator bar 2.0 0.05 4.0 0.1
ESDALC6V1-1BM2
O 1.5 0.1
1.75 0.1
1.10 0.05
3.5 - 0.1
0.66 0.05
All dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
8.0 0.3
0.68 0.05
4.0 0.1
User direction of unreeling
4
Ordering information
Part number ESDALC6V1-1BM2 Marking P(1) Package SOD-882 Weight 0.89 mg Base qty 3000 Delivery mode Tape and reel
1. The marking can be rotated by 90 to diferentiate assembly location
5
Revision history
Date 11-Jan-2007 Revision 1 Initial release. Changes
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ESDALC6V1-1BM2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
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